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ts12001 final datasheet rev 1.3 april 30, 2015 1 of 11 semtech ts12001 triune products nanosmart? battery management under-voltage load switch features ? of-active? feature with ultra-low pico-amp current ? best-in-class of-active? quiescent current of 100pa ? ultra-low on-active quiescent current of 70na ? accurate on to of-active? voltage threshold ? threshold voltage options of 1.2v - 4.2v in 100mv steps (programmed at manufacturing) ? supervisory over-current limit shutdown ? low rds(on): 175m typical @ 5v ? low drop out disconnect from vbat to loads ? turn-on slew rate controlled ? 500mv of to on-active hysteresis summary specifcations ? wide input voltage range: 1.2v C 5.5v ? packaged in a 8pin dfn (2x2) description the ts12001 of-active? battery management load switch is used to protect a battery from excessive discharge. it consists of an internally generated threshold voltage (vthresh), comparator with hysteresis, slew rate control for the load switch, a p-channel load switch, and an open-drain indicator pin. when the input battery voltage is above vthresh, the load switch is on-active. when the input battery voltage falls to vthresh, the load switch is of-active? and the quiescent current draw is approximately 100pa. applications ? portable battery ? industrial ? medical ? smartcard ? rfid ? energy harvesting systems block diagram gn d re gula te d th re sh ol d vo ut np g vc c www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 2 of 11 semtech charger load disconnect the load ts12001 gnd vout npg vcc c byp charger load disconnect the battery ts12001 gnd vout npg vcc c byp note: when the ts12001 is off-active?, the battery will continue to charge through the body diode between vout and vcc. typical applications www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 3 of 11 semtech pin description pin # pin name pin type (1) description 1 gnd p gnd 2 v out o output to system load 3 nc no connect (connect to gnd or foat) 4 nc no connect (connect to gnd or foat) 5 nc no connect (connect to gnd or foat) 6 v cc i/p supply input 7 v cc i/p supply input 8 npg o open-drain n-channel output (low indicates power good) (1) i = input, o = output, p = power absolute maximum ratings over operating freeCair temperature range unless otherwise noted (2, 3, 4) parameter value unit vcc, vout, npg -0.3 to 6.0 v electrostatic discharge C human body model 2 kv operating junction temperature range, t j -20 to 85 c storage temperature range, t stg -65 to 150 c lead temperature (soldering, 10 seconds) 260 c (2) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating con - ditions is not implied. exposure to absoluteCmaximumCrated conditions for extended periods may affect device reliability. (3) all voltage values are with respect to network ground terminal. (4) esd testing is performed according to the respective jesd22 jedec standard. thermal characteristics package dfn ja (c/w) (see note 5) jc (c/w) (see note 6) 8 pin 73.1 10.7 (5) this assumes a fr4 board only. (6) this assumes a 1 oz. copper jedec standard board with thermal vias C see exposed pad section and application note for more information. www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 4 of 11 semtech recommended operating conditions parameter min typ max unit unregulated supply input voltage (v cc ) 1.2 5.5 v operating ambient temperature, t a (note 7) -20 55 c operating junction temperature, t j -20 85 c input bypass capacitor (c byp ) 100 nf (7) ta max shown here is a guideline. higher t a can be tolerated if t j does not exceed the absolute maximum rating. characteristics electrical characteristics, v cc = 1.2v to 5.5v, tj = 25c, unless otherwise noted symbol parameter condition min typ max unit input supply v cc input supply voltage 1.2 5.5 v i q-on quiescent current: on-active mode v cc = 5v, no load 70 150 na i q-off quiescent current: of-active? mode v cc < v thresh , no load 100 pa load switch i oc over current shutdown v cc = 5.0v 3 a t oc over current retry period v cc = 5.0v 1.7 ms i leak-sw output switch leakage current v cc < v thresh ; v out grounded 100 pa rds-on switch on resistance v cc = 5.0v 175 m v cc = 3.3v 200 m v cc = 1.8v 350 m transition times t d1 transition delay: on-active to of-active? v off = 2.0v, v cc = 3.0v f 1.5v 650 s t d2 transition delay: of-active? to on-active v off = 2.0v, v cc = 1.5v f 3.0v 1.7 ms t on output turn-on rise time v cc = 2.5v, r load = 50 200 s npg output i leak-npg output leakage v cc = 5.0v, v npg = 5.5v 100 na v ol-npg low-level output voltage i npg = 5 ma 0.4 v of-active thresholds v off of-active? threshold v thresh = 1.2v to 3.3v 0.95* v thresh v thresh 1.05* v thresh v v hys of-active? to on-active hysteresis rising transition: of-active? to on-active 500 mv www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 5 of 11 semtech typical characteristics 5 specifications subject to change www.triunesystems.com copyright ? 2012, triune systems, llc ts12001 version 1.3 typical characterist ics on - active / off - active ? c haracteristics on - active switching behavior on - active / off - active ? i q off - active ? v thresh temperature performance on - active / off - active ? transition delay over current retry performance 6 specifications subject to change www.triunesystems.com copyright ? 2012, triune systems, llc ts12001 version 1.3 package mechanical d rawings www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 6 of 11 semtech units millimeters dimension limits min nom max number of pins n 8 pitch e 0.50 bsc overall height a 0.80 0.90 1.00 standof a1 0.00 0.02 0.05 contact thickness a3 0.20 ref overall length d 2.00 bsc exposed pad width e2 0.75 0.90 1.00 overall width e 2.00 bsc exposed pad length d2 1.55 1.70 1.80 contact width b 0.18 0.25 0.30 contact length l 0.20 0.30 0.40 contact-to-exposed pad k 0.20 - - notes: dimensions and tolerances per asme y14.5m. bsc: basic dimension. theoretically exact values shown without tolerances. ref: reference dimension, usually without tolerance, for information only. package mechanical drawings (all dimensions in mm) www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 7 of 11 semtech 7 specifications subject to change www.triunesystems.com copyright ? 2012, triune systems, llc ts12001 version 1.3 recommended pcb land pattern recommeded pcb land pattern dimensions in millimeters units millimeters dimension limits min nom max contact pitch e 0.50 bsc optional center pad width w2 - - 1.70 optional center pad length t2 - - 0.90 contact pad spacing c1 - 2.00 - contact pad spacing c2 - - - contact pad width (x8) x1 - - 0.35 contact pad length (x8) y1 - - 0.65 distance between pads g 0.15 - - www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 8 of 11 semtech functional description (continued) application using a multi-layer pcb to maximize the efciency of this package for application on a single layer or multi-layer pcb, certain guidelines must be followed when laying out this part on the pcb. the following are guidelines for mounting the exposed pad ic on a multi-layer pcb with ground a plane. package th er ma l pa d so ld er pad (lan d pa tt er n) th er ma l vi a' s package ou tl in e package and pcb la nd co nf ig ur atio n fo r a mu lt i- la ye r pc b jedec standard fr4 pcb cross-section: (square) pa ckage solder pa d package solder pad (bottom tr ace ) thermal vi a component tr aces thermal isolatio n powe r plane only 1.5748mm 0.0 - 0.071 mm board base & bottom pa d 0.5246 - 0.5606 mm powe r plan e (1oz cu ) 1.0142 - 1.0502 mm ground plan e (1oz cu ) 1.5038 - 1.5748 mm component tr ace (2oz cu) 2 plan e 4 plan e multi-layer board (cross-sectional view) in a multi-layer board application, the thermal vias are the primary method of heat transfer from the package thermal pad to the internal ground plane. the efciency of this method depends on several factors, including die area, number of thermal vias, thickness of copper, etc. www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 9 of 11 semtech the above drawing is a representation of how the heat can be conducted away from the die using an exposed pad package. each application will have diferent requirements and limitations and therefore the user should use sufcient copper to dissipate the power in the system. the output current rating for the linear regulators may have to be de-rated for ambient temperatures above 85c. the de-rate value will depend on calculated worst case power dissipation and the thermal management implementation in the application. application using a single layer pcb use as mu ch co pper ar ea as po ssib le fo r he at sp re ad package th er ma l pa d package ou tl in e layout recommendations for a single layer pcb: utilize as much copper area for power management. in a single layer board application the thermal pad is attached to a heat spreader (copper areas) by using low thermal impedance attachment method (solder paste or thermal conductive epoxy). in both of the methods mentioned above it is advisable to use as much copper traces as possible to dissipate the heat. important: if the attachment method is not implemented correctly, the functionality of the product is not guaranteed. power dissipation capability will be adversely afected if the device is incorrectly mounted onto the circuit board. mold compoun d di e epoxy die attach exposed pa d solder thermal vias with cu plating single layer, 2oz cu ground layer, 1oz cu signal layer , 1oz cu bottom layer, 2oz cu 20% cu coverage 90% cu coverage 5% - 10% cu coverage note: not to scal e www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 10 of 11 semtech ordering information ts12001-cvvvdfnr part number description vvv threshold voltage (v thresh )* 017 1.7 v 021 2.1 v 023 2.3 v 024 2.4 v 025 2.5 v 026 2.6 v 028 2.8 v 030 3.0 v * custom values also available (1.2v - 4.2v typical in 100mv increments) rohs and reach compliance triune systems is fully committed to environmental quality. all triune systems materials and suppliers are fully compliant with rohs (european union directive 2011/65/eu), reach svhc chemical restrictions (ec 1907/2006), ipc-1752 level 3 materials declarations, and their subsequent amendments. triune systems maintains certifed laboratory reports for all product materials, from all suppliers, which show full compliance to restrictions on the following: ? cadmium (cd) ? chlorofuorocarbons (cfcs) ? chlorinate hydrocarbons (chcs) ? halons (halogen free) ? hexavalent chromium (crvi) ? hydrobromofuorocarbons (hbfcs) ? hydrochlorofuorocarbons (hcfcs) ? lead (pb) ? mercury (hg) ? perfuorocarbons (pfcs) ? polybrominated biphenyls (pbb) ? polybrominated diphenyl ethers (pbdes) www.semtech.com
ts12001 final datasheet rev 1.3 april 30, 2015 11 of 11 semtech contactfinformation semtechfcorporation 200fflynnfroad,fcamarillo,fcaf93012 phone:f(805)f498-2111,ffax:f(805)f498-3804 www.semtech.com importantfnotice informationfrelatingftofthisfproductfandfthefapplicationforfdesignfdescribedfhereinfisfbelievedftofbefreliable,fhoweverfsuchfinformationfisfprovidedfasfaf guidefonlyfandfsemtechfassumesfnofliabilityfforfanyferrorsfinfthisfdocument,forfforfthefapplicationforfdesignfdescribedfherein.fsemtechfreservesfthefrightf tofmakefchangesftofthefproductforfthisfdocumentfatfanyftimefwithoutfnotice.fbuyersfshouldfobtainftheflatestfrelevantfinformationfbeforefplacingfordersf andfshouldfverifyfthatfsuchfinformationfisfcurrentfandfcomplete.fsemtechfwarrantsfperformancefoffitsfproductsftofthefspecifcationsfapplicablefatftheftimef offsale,fandfallfsalesfarefmadefinfaccordancefwithfsemtechsfstandardftermsfandfconditionsfoffsale. semtechfproductsfarefnotfdesigned,fintended,fauthorizedforfwarrantedftofbefsuitablefforfusefinflife-supportfapplications,fdevicesf orfsystems,forfinfnuclearfapplicationsfinfwhichftheffailurefcouldfbefreasonablyfexpectedftofresultfinfpersonalfinjury,flossfofflifef orfseverefpropertyforfenvironmentalfdamage.finclusionfoffsemtechfproductsfinfsuchfapplicationsfisfunderstoodftofbefundertakenf solelyfatfthefcustomersfownfrisk.fshouldfafcustomerfpurchaseforfusefsemtechfproductsfforfanyfsuchfunauthorizedfapplication,fthefcustomerfshallf indemnifyfandfholdfsemtechfandfitsfofcers,femployees,fsubsidiaries,fafliates,fandfdistributorsfharmlessfagainstfallfclaims,fcostsfdamagesfandfattorneyf feesfwhichfcouldfarise. thefsemtechfnamefandflogofarefregisteredftrademarksfoffthefsemtechfcorporation.fallfotherftrademarksfandftradefnamesfmentionedfmayfbefmarksfandf namesfoffsemtechforftheirfrespectivefcompanies.fsemtechfreservesfthefrightftofmakefchangesfto,forfdiscontinuefanyfproductsfdescribedfinfthisfdocumentf withoutffurtherfnotice.fsemtechfmakesfnofwarranty,frepresentationforfguarantee,fexpressforfimplied,fregardingfthefsuitabilityfoffitsfproductsfforfanyf particularfpurpose.fallfrightsfreserved.f ?fsemtechf2015

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